Materials Science and Advanced Applications of Wire Bonding in Microelectronics Packaging: From Fine-Pitch Interconnects to Next-Generation Reliability
DETAILS
Call for Papers
Materials Science and Advanced Applications of Wire Bonding in Microelectronics Packaging: From Fine-Pitch Interconnects to Next-Generation Reliability
Journal: Microelectronics International
Publisher: Emerald Publishing
Special Issue
Manuscript Submission Opens: 3 August 2026
Abstract Submission Deadline: 28 February 2027
Manuscript Submission Deadline: 31 March 2027
Microelectronics International invites submissions for a Special Issue focused on materials science, process technologies, reliability, and advanced applications of wire bonding in modern microelectronics packaging.
About the Special Issue
Wire bonding remains one of the most widely used first-level interconnect technologies in microelectronics packaging because of its reliability, versatility, and cost effectiveness. Advances in bonding-wire materials, metallurgical engineering, process technologies, encapsulation chemistry, and intelligent manufacturing are extending its capabilities into increasingly sophisticated applications.
The Special Issue seeks research spanning fundamental materials science through next-generation industrial applications, including fine-pitch interconnects, heterogeneous System-in-Package (SiP), power electronics, automotive systems, MEMS and sensors, photonics, biomedical devices, chiplets, SiC/GaN modules, hybrid packaging, and AI/ML-assisted wire bonding.
Topics of Interest
Bonding Wire Materials & Metallurgy
Au, Cu, Ag, and Pd/Au-coated Cu bonding wires
Recycled Au bonding wires
Bonding-wire alloying
EBSD texture analysis
Drawing and annealing effects
Bondability and materials reliability
Intermetallic Compounds & Interfacial Reactions
Au-Al, Cu-Al, and Ag-Al intermetallic compounds
IMC formation and growth kinetics
Phase evolution
Kirkendall voiding
Oxidation and diffusion modelling
Bond-pad metallization effects
Process Technology & Equipment
Thermosonic bonding optimization
Free-air-ball control
Fine-pitch bonding below 30 µm
Low-loop structures
Stand-off stitch bonding
Advanced wire-bonding equipment and processes
Encapsulation & Environmental Interactions
EMC and DAF chemistry
Ion-catcher systems
Moisture-bias effects
Halide mobility
Cu corrosion
Wire sweep and loop stability
Encapsulation effects on bond integrity
Reliability & Failure Analysis
High-temperature storage life (HTSL)
uHAST, TCT, and PCT reliability testing
Drop and shock reliability
Stitch lift
Heel cracking
IMC fracture
Advanced failure-analysis methods
Advanced Applications
Power electronics
Automotive electronics
MEMS and sensors
Photonics
Biomedical devices
Heterogeneous SiP integration
Chiplet-based packaging
SiC/GaN heavy-ribbon modules
Hybrid Wire-Bonding Technologies & AI-Assisted Bonding
Hybrid wire-bond and flip-chip packaging
Wire bonds with Cu posts and Cu pillars
Mixed-interconnect process windows and reliability
Pad and redistribution-layer design
Mixed flip-chip/wire-bond SiP modules
Stacked-die integration
Underfill interactions and warpage
Substrate co-design and interposers
Chiplet routing
AI/ML-assisted wire bonding
AI-based loop optimization
Reference-point detection
Adaptive calibration and predictive control
Automated optical inspection defect classification
Bonder digital twins
AI-assisted recipe generation
Research Focus
The Special Issue aims to connect fundamental materials and interfacial science with advanced packaging processes, reliability engineering, and intelligent manufacturing.
Research addressing the integration of conventional wire bonding with emerging packaging architectures, as well as AI/ML-enabled optimization and automation of bonding processes, is particularly relevant.
Submission Information
Manuscript Submission Opens: 3 August 2026
Abstract Submission Deadline: 28 February 2027
Manuscript Submission Deadline: 31 March 2027
Manuscripts should be submitted through the Microelectronics International ScholarOne Manuscripts system.
During submission, authors should select the Special Issue titled “Materials Science and Advanced Applications of Wire Bonding” when prompted to select the issue they are submitting to.
Submitted manuscripts must follow the journal's author guidelines, be original, and must not have been previously published or be under consideration for publication elsewhere while under review.
Guest Editors
Dr C L Gan
Email: clgan@micron.com
Dr Christopher Breach
Email: chris@wire-connections.com
Dr Chen-Yu (Luka) Huang
Email: lukahuang@micron.com
Posted on ServiceSetu Academics — Premier Platform for Academic Opportunities & Research Collaboration.
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